TSMC: Powering the Future of Technology

TSMC: Powering the Future of Technology

The world's leading dedicated semiconductor foundry

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• Company Overview: Overview of TSMC's position in the global semiconductor industry.
• Historical Evolution: Key historical milestones from inception to the present.
• Core Competencies & Operations: Manufacturing capabilities, process nodes, and key customers.
• Global Footprint: TSMC Arizona: International expansion with focus on Arizona.
• Summary & Future Outlook: Recap of market position and future outlook.

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1

Company Overview

Understanding TSMC's role in the global economy

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• World's largest dedicated semiconductor foundry, founded in 1987.
• Holds approximately 70% of the global semiconductor foundry market.
• Strategic supplier for industry giants like Nvidia, Apple, Broadcom, and Qualcomm.
• Critical role in the global supply chain, particularly for advanced AI chips.
• Ranked 38th in Forbes Global 2000 (2025).

• 70%: Market Share
• 17.4%: Revenue CAGR
• 16.1%: Earnings CAGR

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Historical Evolution

Milestones of innovation and leadership

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1987: Company Founding Founded by Morris Chang as a joint venture with Taiwan's government and ITRI. First dedicated foundry. 1993/1997: Public Listing Listed on Taiwan Stock Exchange (1993) and New York Stock Exchange (1997). 2018: Leadership Transition Morris Chang retires; Mark Liu becomes Chairman and C.C. Wei becomes CEO. 2025/Future: Current Era Continued dominance and massive expansion in Arizona.

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Core Competencies & Operations

Manufacturing excellence and customer relationships

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Manufacturing Excellence

• Global capacity: 13 million 300mm-equivalent wafers (as of 2020).
• Advanced production: Nodes from 2 microns to 3 nanometers.
• Pioneer in EUV lithography integration.
• First to market 7nm and 5nm production.

Customer Ecosystem

• Serves major fabless companies: Apple, Nvidia, AMD, ARM, Qualcomm, Broadcom.
• Supports emerging innovators like HiSilicon and UNISOC.
• Partners with IDMs outsourcing production (e.g., Intel, STMicroelectronics).

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TSMC Arizona

Expanding presence in the United States

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• Total pledge: USD 165 billion, one of the largest foreign direct investments in U.S. manufacturing.
• "Gigafab" cluster planned: 6 fabs, 2 advanced packaging facilities, and an R&D center.
• First fab operational: Producing 4nm chips.
• Future milestones: 3nm production targeted for 2027; 2nm for 2029.

Summary: Leading the Semiconductor Era

TSMC remains the foundational pillar for global technological progress and AI advancement.

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