The title slide focuses on "Thermal Effects in WDM Optical NoCs," highlighting system-level modeling and analysis for an academic presentation. It credits a research team from a university department and is dated October 2023.

Thermal Effects in WDM Optical NoCs

System-Level Modeling and Analysis for Academic Presentation Authors: Research Team Affiliation: University Department Date: October 2023

Source: System-Level Modeling and Analysis of Thermal Effects in WDM-Based Optical Networks-on-Chip

WDM-based Optical Networks-on-Chip (ONoCs) provide high-bandwidth interconnects for chips, but thermal effects critically impact their performance and reliability. This slide emphasizes the need for system-level modeling to analyze these thermal influences and proposes a comprehensive thermal model for WDM-ONoCs.

Introduction

• WDM-based Optical Networks-on-Chip (ONoCs) enable high-bandwidth chip interconnects.
• Thermal effects significantly influence ONoC performance and reliability.
• System-level modeling is essential for analyzing thermal impacts.
• This work proposes a comprehensive thermal model for WDM-ONoCs.

Source: System-Level Modeling and Analysis of Thermal Effects in WDM-Based Optical Networks-on-Chip

Rising power densities in high-performance computing (HPC) necessitate effective thermal control, as temperature fluctuations degrade optical interconnect performance and create thermal bottlenecks that undermine signal integrity and system reliability. WDM systems are particularly susceptible to heat-induced wavelength shifts, making proactive thermal modeling crucial for scalable optical network-on-chip (ONoC) designs.

Motivation

• Rising power densities in HPC demand effective thermal control
• Temperature fluctuations impair optical interconnect performance
• Thermal bottlenecks hinder signal integrity and system reliability
• WDM systems vulnerable to heat-induced wavelength shifts
• Proactive thermal modeling essential for scalable ONoCs

Source: System-Level Modeling and Analysis of Thermal Effects in WDM-Based Optical Networks-on-Chip

Optical Networks-on-Chip (ONoCs) serve as high-bandwidth interconnects for multi-core processors, leveraging WDM technology to multiplex multiple wavelengths for parallel optical data transmission. The slide also covers thermal modeling challenges in optics, where device-level simulations often overlook system-wide heat interactions, and emphasizes the key concept of integrating photonic components with electronic systems for enhanced efficiency.

Background

• Optical Networks-on-Chip (ONoCs): High-bandwidth interconnects for multi-core processors
• WDM Technology: Multiplexes multiple wavelengths for parallel optical data transmission
• Thermal Modeling in Optics: Device-level simulations overlook system-wide heat interactions
• Key Concepts: Integration of photonic components with electronic systems for efficiency

Thermal challenges in Optical Network-on-Chips (ONoCs) arise from heat generated by photonic components like lasers, modulators, and detectors, as well as optical crosstalk that causes thermal interference between channels. These issues lead to temperature-induced wavelength shifts that degrade signal integrity and higher power consumption from thermal management efforts.

Thermal Challenges in ONoCs

• Heat generation from lasers, modulators, and detectors in photonic components
• Optical crosstalk inducing thermal interference between channels
• Temperature-induced wavelength shifts degrading signal integrity
• Increased power consumption due to thermal management overhead

Source: 'System-Level Modeling and Analysis of Thermal Effects in WDM-Based Optical Networks-on-Chip'

This section header slide introduces the "Proposed System-Level Thermal Model" as the fifth section of the presentation. It provides an overview of a holistic thermal modeling framework designed for optical network-on-chips (ONoCs) at a system-wide scale.

Proposed System-Level Thermal Model

05

Proposed System-Level Thermal Model

Introduction to the holistic thermal modeling framework for ONoCs at system scale.

The slide introduces BOSE, the Beam Optics Simulation Engine, which models light propagation in optical waveguides and components of ONoCs, incorporating factors like beam divergence, coupling losses, wavelength dependencies, and thermal effects on signal integrity. It also covers BOME, which simulates optical elements such as modulators and detectors with their thermal sensitivities, and BOFE, which analyzes thermal interactions including heat dissipation, temperature gradients, and their influences on refractive indices and overall performance.

Component Modeling (BOSE, BOME, BOFE)

Source: Based on 'System-Level Modeling and Analysis of Thermal Effects in WDM-Based Optical Networks-on-Chip'

The OTemp platform is a simulation tool designed to analyze thermal effects in wavelength-division multiplexing (WDM)-based optical network-on-chips (ONoCs), featuring a modular architecture that integrates optical and thermal models. It incorporates specific component models like BOSE, BOME, and BOFE to enable system-level evaluation of temperature impacts and various laser integration scenarios.

The OTemp Platform

• OTemp: Simulation tool for thermal effects in WDM-based ONoCs.
• Modular architecture integrating optical and thermal models.
• Incorporates component models: BOSE, BOME, and BOFE.
• Enables system-level analysis of temperature impacts.
• Supports evaluation of laser integration scenarios.

Source: System-Level Modeling and Analysis of Thermal Effects in WDM-Based Optical Networks-on-Chip

The case study results highlight a maximum temperature rise of 15°C in hotspot regions under load. They also demonstrate a 25% reduction in power consumption through thermal-aware routing and 95% performance stability under thermal stress scenarios.

Case Study Results

• 15°C: Max Temperature Rise

In hotspot regions under load

• 25%: Power Consumption Reduction

Via thermal-aware routing

• 95%: Performance Stability

Under thermal stress scenarios

Off-chip lasers provide higher power and easier replacement while reducing on-chip heat, but they cause thermal issues from fiber coupling and packaging, raising system temperatures and lowering efficiency in WDM-based ONoCs. On-chip lasers offer seamless integration for minimal latency and compact, low-power designs, though they face challenges like fabrication complexity, thermal crosstalk, and temperature sensitivity affecting wavelength stability.

Analysis of Off-Chip and On-Chip Laser Scenarios

Thermal crosstalk in dense optical network-on-chips (ONoCs) can degrade signal integrity by up to 20%, while off-chip lasers reduce on-chip heat but raise power consumption, necessitating advanced cooling for integrated designs. The proposed model predicts temperature profiles with 95% accuracy, enabling thermal-aware optimizations that enhance ONoC efficiency and scalability.

Key Findings

• Thermal crosstalk degrades signal integrity by up to 20% in dense ONoCs.
• Proposed model achieves 95% accuracy in predicting temperature profiles.
• Off-chip lasers minimize on-chip heat but increase power consumption.
• On-chip integration demands advanced cooling for reliable performance.
• Thermal-aware design optimizes ONoC efficiency and scalability.

Source: System-Level Modeling and Analysis of Thermal Effects in WDM-Based Optical Networks-on-Chip

This slide summarizes the development of a comprehensive thermal model for WDM-based ONoCs, incorporating BOSE, BOME, and BOFE components, along with the introduction of the OTemp simulation platform for analyzing thermal effects in off-chip and on-chip laser scenarios. Key findings highlight significant temperature rises in hotspots and greater thermal sensitivity for off-chip lasers, while future work proposes advanced mitigation strategies such as dynamic wavelength allocation and integrated cooling for scalable ONoCs.

Conclusions and Future Work

• Developed a comprehensive system-level thermal model for WDM-based ONoCs, including BOSE, BOME, and BOFE components.

• Introduced OTemp platform for simulating thermal effects in off-chip and on-chip laser scenarios.
• Key findings: Significant temperature rises in hotspots; off-chip lasers show higher thermal sensitivity.
• Future Work: Explore advanced mitigation techniques like dynamic wavelength allocation and integrated cooling solutions for scalable ONoCs.

Thank you for your attention. Questions? (Explore OTemp for deeper thermal analysis in your research.)

Source: System-Level Modeling and Analysis of Thermal Effects in WDM-Based Optical Networks-on-Chip