The slide outlines the Wafer Manufacturing Workflow in a table with phases, owners, and durations. It covers Crystal Formation (several days, Crystal Growth Team) through Final Polishing (15-30 minutes, Polishing Team), with intermediate steps like Slicing & Grinding, Cleaning, and Texturing & Etching.
Wafer Manufacturing Workflow
Source: Semiconductors Presentation
Speaker Notes
This slide outlines the key steps in silicon wafer manufacturing for semiconductor production. Highlight the Czochralski process as the standard method for crystal growth, and note how each subsequent step prepares the wafer surface for device fabrication.